Inorganic oxide plating film

PVDC, which is widely used as a high-barrier packaging material, has a tendency to cause environmental pollution due to the HCI generated when the waste is burned, and is currently being replaced by other packaging materials. For example, a so-called plating film obtained by plating SIOx (silicon oxide) on a thin film of other substrates has attracted attention, and in addition to the silicon oxide film, there is an aluminum oxide vapor-deposited film. Its airtight properties are the same as the silicon oxide films obtained in the same way.

In recent years, multi-layer compounding, blending, copolymerization, and vapor deposition technologies have developed extremely rapidly. High-barrier packaging materials such as ethylene vinyl alcohol copolymer (EVOH), polyvinylidene chloride (PVDC), polyamine (PA), polyethylene terephthalate (PET) multilayer composites and silicon oxides Vapor deposition of thin films has been further developed, among which the following products are particularly noticeable: MXD6: polyamide packaging material; polyethylene naphthalate (PEN); silicon oxide evaporated film.